Ãëàâíàÿ ñòðàíèöà ñàéòà Êàòàëîã ¹1 Êàòàëîã ¹3 Êàòàëîã ¹4 Ðàñïå÷àòàòü
Ãëàâíàÿ ñòðàíèöà êàòàëîãà Ïðåäûäóùàÿ ñòðàíèöà   Ñëåäóþùàÿ ñòðàíèöà

ÌÈÊÐÎÑÕÅÌÛ

ÑÈÑÒÅÌÀ ÎÁÎÇÍÀ×ÅÍÈÉ
MAX 631 A C P P
1 2 3 4 5 6

ÏÐÎÃÐÀÌÌÀ ÏÎÑÒÀÂÎÊ

ÎÁËÀÑÒÜ ÏÐÈÌÅÍÅÍÈß

  1. Ïðåôèêñ, îçíà÷àþùèé ïðîèçâîäèòåëÿ (MAX - MAXIM)
  2. Ñåðèéíûé íîìåð ðàçðàáîòêè
  3. Ðàçáðîñ ýëåêòðè÷åñêèõ ïàðàìåòðîâ (äëÿ íåêîòîðûõ ñåðèé ìîæåò îòñóòñòâîâàòü)
  4. Äèàïàçîí ðàáî÷èõ òåìïåðàòóð
    C – 0…+70°C
    I – -20…+85°C
    E – -40…+85°C
    M – -55…+125°C
  5. Òèï êîðïóñà
    A – SSOP
    B – CerQUAD
    C – TO-220, TQFP
    D – Cer.Sidebraze
    E – QSOP
    F – Cer.FlatPack
    H – Module, SBGA
    J – CerDIP
    K – TO-3, PPGA
    L – LCC
    M – MQFP
N – NarrowDIP
P – PDIP
Q – PLCC
R – CerDIP (300mil)
S – SO (150mil)
T – TO–5 (0.230 pin circle)
U – TSSOP, mMAX, SOT
V – TO–39
W – SO (300mil)
X – JLCC
Y – Narrow Sidebraze
Z – TO–92, MQUAD
/D – Dice
/PR – Rugged Plastic
/W – Wafer
  1. Êîëè÷åñòâî âûâîäîâ
    A – 8
    B – 10, 64
    C – 192
    D – 14
 E – 16
F – 256
G – 24
H – 44
I – 28
J – 32
K – 5, 68
L – 40
M – 7, 48
N – 18
O – 42
P – 20
Q – 2, 100
R – 3, 84
S – 4, 80
T – 6, 160
U – 60
V – 8 (0.200“ pin circle)
W – 10 (0.230“ pin circle)
X – 36
Y – 8 (0.200“ pin circle)
Z – 10 (0.230“ pin circle)